Layout Optimisation And Package Enhancements To Minimise Switch Node Ringing And Associated Radiated EMI In A DC/DC Buck Converter
Switch Node Ringing
- Switch node ringing can be a significant source of EMI.
- Requires a resonant circuit and activation energy at the resonant frequency
Activation Energy
- Higher switching frequency reduces passive component size
- Faster edges increase efficiency
- Both increase activation energy
Resonant Circuit
- LLoop includes inductance from the track, via, leads, bond wires, ESL
- All should be minimised
Slow Down The Edges
- Adding a resistor in series with the boot capacitor slows the rise time
- The slower edge reduces the efficiency
- Recommend 0R0 RBOOT and only add resistance if required
- Gate drive resistors also possible for controllers with external FETs
Use A Snubber
- Snubber absorbs energy, damping the resonance of parasitic elements
- Reduces efficiency
- Snubber placement can compromise the layout
Add a High-Frequency Capacitor
Select CHF with πππππ > ππππππππ
Input Capacitor Position
- Every millimetre makes a difference! Minimize the area of the loop from
CIN to VIN and PGND back to CIN. Return current directly to the source. - HF Capacitor closest to the VIN pin
Smaller, Cooler, Quieter
- Smaller means higher switching frequency
- Efficiency (cooler) requires the fastest edges
- Tightly packed circuits may be more susceptible to EMI
Hotrodβ’ Package
- Pin assignment and footprint optimised for layout
- Butterfly layout reduces inductance through parallel paths (& magnetic field cancellation)
- Flip chip on copper column eliminates bond wire inductance
- Reduces series resistance
- Enhanced thermal path
Capacitor On Leadframe
- High frequency capacitors integrated into package on the lead frame
Summary
- Switch node ringing can be a significant source of EMI
- Activation energy is increased by higher switching frequency and faster edges
- Resonant frequency is a product of the COSS and LLOOP.
- Circuit/PCB solutions: bootstrap resistor, snubber, HF capacitor, CIN position.
- Package innovations for high fswitch: HotRodTM, flip chip on Cu column, the capacitor on a lead frame.
Dr Jim Perkins – Senior Member Technical Staff – Texas Instruments